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Product Name: VLP Electrolytic Copper Foil
Product OEM: Available
Payment Terms: L/C, T/T, PayPal, Western Union...
VLP Electrolytic Copper Foil characteristics:
Degraded rate of HCΦ(18%-1hr/25℃)
Change of color(E-1.0hr/200℃)
Solder Floating 290℃
Appearance(Spot and copper powder)
Inside Diameter 79mm/3 inch
1. The Rz value of copper foil wool surface is the test stability value, which is not guaranteed.
2. The stripping strength is the standard fr-4 board test value (5 pieces 7628PP).
3. The performance index is subject to the company's listening test method. The warranty period shall be 90 days from the date of receipt of the goods.
The company can provide 1/ 40z-3oz (nominal thickness of 9um ~105um) ultra-low profile high temperature ductility ultra-thick electrolytic copper foil (VLP), and the maximum size of the product is 1295mmx1295mm sheet copper foil.
VLP Electrolytic Copper Foil Characteristics:
The ultra-thick electrolytic copper foil provided by the company has the fine physical properties of equiaxial fine crystal, low profile, high strength and high elongation.
Compared with similar products abroad: 1.The grain structure of our VLP super thick electrolytic copper foil is equiaxial fine crystal ball;
The grain structure of similar products abroad is columnar.2. Our company's ultra-thick electrolytic copper foil is ultra low profile, 30z copper foils Rzs3.5um and the foreign similar products are standard contour, 30z copper foils Rz > 3.5um.
VLP Electrolytic Copper Foil Application:
It is suitable for manufacture of high power circuit board and high frequency board, such as automobile, electric power, communication, military industry, aerospace, etc.
Advantage of VLP Electrolytic Copper Foil Application
1. Since our products are ultra-low profile, the insulation chip causes the potential risk of short circuit.
2. Because the grain structure of our products is spherical, the time of line etching is shortened, and the problem of uneven side erosion is improved.
3, at the same time with high peel strength, copper powder, clear graphics of PCB manufacturing transfer performance: definitely in the suppression of double panel, "spike", because of the large standard thick copper foil roughness easily pierced thinner pp.
1. Standard Exporting package.
2. Original package or neutral package.
3. According to clients ' needs.
4. Shipped in10-35 days after payment.
Small Order Acceptable
Spot delivery, including delivering small batches of goods
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